Next Semi Trade: $TTMI
TTM Technologies is the primary US-listed PCB supplier and should benefit significantly as Nvidia ramps Vera Rubin GPU production starting Q3 2026, given PCB costs are projected to increase 233% in the new architecture.
| Window | Theses | Resolved | Wins | Win rate | Avg return | Median return |
|---|---|---|---|---|---|---|
| 1d | 19 | 19 | 7 | 37% | -0.6% | -0.5% |
| 3d | 19 | 19 | 14 | 74% | +2.4% | +2.9% |
| 1w | 20 | 20 | 7 | 35% | -2.3% | -2.0% |
| 1m | 18 | 18 | 15 | 83% | +15.5% | +15.7% |
| 3m | 0 | 0 | 0 | — | — | — |
| 6m | 0 | 0 | 0 | — | — | — |
| 1y | 0 | 0 | 0 | — | — | — |
Past performance does not predict future results. Informational only.
TTM Technologies is the primary US-listed PCB supplier and should benefit significantly as Nvidia ramps Vera Rubin GPU production starting Q3 2026, given PCB costs are projected to increase 233% in the new architecture.
Infrastructure and data center stocks are benefiting from a historic buildout cycle. The author deployed medium-dated calls across the sector, betting on continued upside momentum.
Quanta Services provides infrastructure and power delivery solutions for data centers and AI buildout. The author sees substantial upside from the accelerating demand for data center infrastructure.
STMicroelectronics manufactures semiconductor components essential for AI infrastructure and data centers. The author expects significant gains from the 12-24 month AI infrastructure expansion cycle.
CoreWeave is a cloud infrastructure provider specializing in AI and GPU-accelerated computing resources. The author sees outsized gains from the explosive growth in AI data center buildout.
GlobalFoundries is a semiconductor foundry critical for manufacturing AI chips and related components. The author is bullish on foundry capacity as infrastructure buildout accelerates.
Applied Optoelectronics manufactures optical interconnect components for data centers and AI infrastructure. The author sees optics and photonics as key bottlenecks with major upside potential.
MACOM manufactures semiconductor and RF components for high-speed networking and data center applications. The author expects significant gains from AI infrastructure demand over the next 12-24 months.
Viavi Solutions provides optical and network testing and monitoring solutions for data center infrastructure. The author is bullish on this enabling technology for AI infrastructure deployment.
Cisco supplies networking infrastructure and switching equipment essential for data center AI buildout. The author views networking as a key component in the broader AI infrastructure expansion.
Ace Technology is positioned to benefit from AI infrastructure and data center buildout. The author sees substantial upside from this less-followed component supplier.
Corning manufactures optical and specialty glass components critical to data center fiber optics and AI infrastructure. The author is bullish on this essential component play for infrastructure expansion.
Forgent Power provides power solutions and components for data centers and AI infrastructure buildout. The author expects significant gains as power becomes a key constraint in scaling AI infrastructure.
Vicor supplies power management and conversion solutions for data centers and AI infrastructure. The author is bullish on power delivery as a critical bottleneck in the AI infrastructure expansion.
Fabrinet provides manufacturing and engineering services for optical and electronic components used in AI data centers. The author sees significant gains from the AI infrastructure buildout across the 12-24 month period.
Lumentum manufactures optical and photonic components essential for data center connectivity and AI infrastructure. The author views lasers and photonics as key bottlenecks with outsized upside potential.
Credo Technologies provides high-speed interconnect and data center networking solutions critical to AI infrastructure. The author is bullish on this sub-component bottleneck play for the next 12-24 months.
DRAM ETF is a play on memory demand from AI infrastructure expansion. The author views memory components as a critical bottleneck in the AI data center buildout cycle.
Ciena stands to gain from data center networking and optical infrastructure demands driven by AI buildout. The author is bullish on networking components as a key bottleneck in the broader infrastructure expansion.
Amkor is positioned to benefit from the AI infrastructure build-out cycle, specifically in semiconductor packaging and components for data centers. The author expects significant gains over a 12-24 month horizon as demand for AI infrastructure intensifies.